Reuters, citing South Korea's Maeil Business Newspaper, reported that Samsung Electronics intends to use a second foundry plant in Taylor, Texas, to manufacture advanced base dies for high-bandwidth memory products supplied to AMD and Nvidia. The report claimed that the proposed plant would use 2-nanometer technology, with equipment installation beginning in February 2029 and mass production targeted for 2030. It also claimed that the plant's expected output had already been committed, primarily to AMD. Samsung declined to comment, so the project specifications, customer commitments, and production schedule remain unconfirmed.
Reuters
Source: Reuters, November 3
Why it matters strategically
Advanced HBM products require increasingly sophisticated integration between memory and logic manufacturing.
If confirmed, the reported investment could strengthen Samsung's position in the AI semiconductor supply chain and expand its U.S. manufacturing presence.
However, customer commitments and manufacturing economics must be distinguished from press reports about future capacity.
